Order from a Major Online Bookstore
Ultimate Book Price Comparison Engine
Save Your Time And Money
| AnyBook4Less.com | Order from a Major Online Bookstore |
|
| Home | Store List | FAQ | Contact Us | | ||
| Ultimate Book Price Comparison Engine Save Your Time And Money |
||
1. |  | Title: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by John H. Lau, Yi-Hsin Pao ISBN: 0070366489 Publisher: McGraw-Hill Professional Pub. Date: 01 September, 1996 List Price: $65.00 Amazon.com Price: $56.55 |
| 2. |  | Title: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies by John H. Lau ISBN: 0071351418 Publisher: McGraw-Hill Professional Pub. Date: 08 February, 2000 List Price: $89.95 Amazon.com Price: $69.26 |
| 3. |  | Title: Chip Scale Package: Design, Materials, Process, Reliability, and Applications by John H. Lau, Ricky S. W. Lee, S. W. Ricky Lee, Ricky S. Lee ISBN: 0070383049 Publisher: McGraw-Hill Professional Pub. Date: 28 February, 1999 List Price: $89.50 Amazon.com Price: $81.44 |
| 4. |  | Title: Solder Joint Reliability: Theory and Applications by John H. Lau ISBN: 0442002602 Publisher: Van Nostrand Reinhold Pub. Date: 15 January, 1991 List Price: $227.00 Amazon.com Price: $227.00 |
| 5. |  | Title: Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by John H. Lau, C. P. Wong, Ning-Cheng Lee, S. W. Ricky Lee ISBN: 0071386246 Publisher: McGraw-Hill Professional Pub. Date: 23 August, 2002 List Price: $99.50 Amazon.com Price: $90.54 |
| 6. |  | Title: Microvias: For Low Cost, High Density Interconnects by John H. Lau, S.W. Ricky Lee ISBN: 0071363270 Publisher: McGraw-Hill Professional Pub. Date: 26 April, 2001 List Price: $99.95 Amazon.com Price: $99.95 |
| 7. |  | Title: Electronic Packaging: Design, Materials, Process, and Reliability by John H. Lau, C.P. Wong, J. L. Prince, W. Nakayama ISBN: 0070371350 Publisher: McGraw-Hill Professional Pub. Date: 01 February, 1998 List Price: $69.00 Amazon.com Price: $62.79 |
| 8. |  | Title: Chip on Board Technologies for Multichip Modules by John H. Lau, John H. Law ISBN: 0442014414 Publisher: Kluwer Academic Publishers Pub. Date: 15 January, 1994 List Price: $178.00 Amazon.com Price: $178.00 |
| 9. |  | Title: Flip Chip Technologies by John H. Lau ISBN: 0070366098 Publisher: McGraw-Hill Professional Pub. Date: 01 December, 1995 List Price: $87.51 Amazon.com Price: $87.51 |
| 10. |  | Title: Ball Grid Array Technology by John H. Lau ISBN: 007036608X Publisher: McGraw-Hill Professional Pub. Date: 01 November, 1994 List Price: $85.00 Amazon.com Price: $85.00 |
Thank you for visiting www.AnyBook4Less.com and enjoy your savings!
Copyright� 2001-2021 Send your comments
