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1. |  | Title: Chip Scale Package: Design, Materials, Process, Reliability, and Applications by John H. Lau, Ricky S. W. Lee, Ricky S. Lee ISBN: 0070383049 Publisher: McGraw-Hill Professional Publishing Pub. Date: 28 February, 1999 List Price: $89.50 Amazon.com Price: $75.18 |
| 2. |  | Title: Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by John H. Lau, C. P. Wong, Ning-Cheng Lee, S. W. Ricky Lee ISBN: 0071386246 Publisher: McGraw-Hill Professional Pub. Date: 23 August, 2002 List Price: $99.50 Amazon.com Price: $84.57 |
| 3. |  | Title: Microvias: For Low Cost, High Density Interconnects by John H. Lau, S.W. Ricky Lee ISBN: 0071363270 Publisher: McGraw-Hill Professional Publishing Pub. Date: 26 April, 2001 List Price: $99.95 Amazon.com Price: $99.95 |
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