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Title: Electronic Packaging: Design, Materials, Process, and Reliability
by John H. Lau, C.P. Wong, J. L. Prince, W. Nakayama
ISBN: 0-07-037135-0
Publisher: McGraw-Hill Professional
Pub. Date: 01 February, 1998
Format: Hardcover
Volumes: 1
List Price(USD): $69.00

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