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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

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Title: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
by John H. Lau, Yi-Hsin Pao
ISBN: 0-07-036648-9
Publisher: McGraw-Hill Professional
Pub. Date: 01 September, 1996
Format: Hardcover
Volumes: 1
List Price(USD): $65.00

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