1.
 |  | Title: Optoelectronic Packaging (Wiley Series in Microwave and Optical Engineering)
by Alan R. Mickelson, Nagesh R. Basavanhally, Yung-Cheng Lee
ISBN: 0471111880
Publisher: Wiley-Interscience
Pub. Date: 18 April, 1997
List Price: $105.00
Amazon.com Price: $95.55 |
2.
|  | Title: Manufacturing Challenges in Electronic Packaging
by Yung-Cheng Lee, W.T. Chen, Y. C. Lee, William T. Chen
ISBN: 0412620308
Publisher: Kluwer Academic Publishers
Pub. Date: 01 December, 1997
List Price: $163.00
Amazon.com Price: $163.00 |
3.
|  | Title: Micro-Optics Integration and Assemblies (Spie Proceedings Series)
by Michael R. Feldman, Yung-Cheng Lee
ISBN: 0819427284
Publisher: SPIE-International Society for Optical Engine
Pub. Date: 01 April, 1998
List Price: $30.00
Amazon.com Price: $30.00 |
4.
|  | Title: Manufacturing Aspects in Electronic Packaging 1993: Presented at the 1993 Asme Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, (AMD)
by Yung-Cheng Lee
ISBN: 0791810321
Publisher: American Society of Mechanical Engineers
Pub. Date: January, 1993
List Price: $40.00
Amazon.com Price: $40.00 |
5.
|  | Title: Manufacturing Aspects in Electronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, Califo (Htd)
by Yung-Cheng Lee
ISBN: 0791811123
Publisher: American Society of Civil Engineers
Pub. Date: January, 1992
List Price: $57.50
Amazon.com Price: $57.50 |
