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Cover ImageTitle: Proceedings of 2nd Electronics Packaging Technology Conference: 8-10 December, 1998, Raffles City Convention Center, Singapore
by Electronic Packaging Technology Conference 1998 Singapore), Lim Thiam Beng, Andrew A. O. Tay, Andrew, A. O. Tay, Thiam Beng Lim, IEEE Reliability Society, Packaging & Manufacturing Technology Society Components, IEEE electron
ISBN: 078035141X
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: 01 December, 1998
List Price: $134.00
Amazon.com Price: $134.00

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