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1. |  | Title: Microelectronics Packaging Handbook: Semiconductor Packaging (Micoelectronics Packaging Handbook, 2nd ed, Pt 2) by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ISBN: 0412084414 Publisher: Kluwer Academic Publishers Pub. Date: 01 January, 1997 List Price: $185.00 Amazon.com Price: $185.00 |
| 2. |  | Title: Microelectronics Packaging Handbook: Technology Drivers (Microelectronics Packaging Handbook, 2nd ed, Pt 1) by Rao R. Tummala, Eugene J. Rytmaszewski, Alan G. Klopfenstein ISBN: 0412084317 Publisher: Kluwer Academic Publishers Pub. Date: 15 January, 1997 List Price: $185.00 Amazon.com Price: $185.00 |
| 3. |  | Title: Plastic Thin Film Ceramic Package by Rao R. Tummala ISBN: 041215451X Publisher: Chapman & Hall Pub. Date: 15 February, 2001 List Price: $64.95 Amazon.com Price: $64.95 |
| 4. |  | Title: Wirebonding Microelect Packaging by Rao R. Tummala ISBN: 0412154811 Publisher: Chapman & Hall Pub. Date: 15 February, 2001 Amazon.com Price: $55.01 |
| 5. |  | Title: Microelectronic Package Wiring Electronic Design by Rao R. Tummala ISBN: 0412154919 Publisher: Chapman & Hall Pub. Date: 15 February, 2001 List Price: $49.95 Amazon.com Price: $49.95 |
| 6. |  | Title: Heat Transfer Elect Packages by Rao R. Tummala ISBN: 0412154617 Publisher: Chapman & Hall Pub. Date: 15 February, 2001 List Price: $39.95 Amazon.com Price: $39.95 |
| 7. |  | Title: Microelectronics Packaging Handbook: Technologies (Electrical Engineering) by Rao R. Tummala, Eugene J. Pymaszewski, Alan G. Klopfenstein ISBN: 0442019637 Publisher: Van Nostrand Reinhold Pub. Date: 01 December, 1989 List Price: $99.95 Amazon.com Price: $99.95 |
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