1.
 |  | Title: Stress-Induced Phenomena in Metallization: First International Workshop, Ithaca, Ny, 1991 (Conference Proceedings, No. 263)
by Che-Yu Li, Paul Totta, Paul Ho
ISBN: 1563960826
Publisher: Springer Verlag
Pub. Date: November, 1997
List Price: $95.00
Amazon.com Price: $95.00 |
2.
|  | Title: Stress-Induced Phenomena in Metallization: Second International Workshop Austin, Tx March 1993 (Aip Conference Proceedings, No 305)
by Che-Yu Li, Paul Totta, P. S. Ho, Paul Tuha
ISBN: 1563962519
Publisher: Springer Verlag
Pub. Date: December, 1994
List Price: $120.00
Amazon.com Price: $120.00 |
3.
|  | Title: Stress-Induced Phenomena in Metallization: Third International Workshop (Aip Conference Proceedings, 373)
by Paul S. Ho, John Bravman, Che-Yu Li, John Sanchez
ISBN: 1563964392
Publisher: Amer Inst of Physics
Pub. Date: December, 1996
List Price: $140.00
Amazon.com Price: $140.00 |
4.
|  | Title: Electronic Packaging Materials Science VI: Symposium Held April 27-30, 1992, San Francisco, California, U.S.A. (Materials Research Society Symposium)
by Paul S. Ho, Kenneth A. Jackson, Che-Yu Li
ISBN: 155899159X
Publisher: Material Research Society
Pub. Date: September, 1993
List Price: $57.00
Amazon.com Price: $57.00 |
5.
|  | Title: Principles of Electronic Packaging
by Ronald C. Lasky, Che-Yu Li, Donald P. Seraphim, Che-Yu Li
ISBN: 0070563063
Publisher: McGraw-Hill Higher Education
Pub. Date: 01 March, 1989
List Price: $114.38
Amazon.com Price: $114.38 |
