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1. |  | Title: Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition November 12-17, 1995 Dan Francisco, California (Eep (Series), V. 11.) by William T. (Edt)/ Pearson, Raymond A. International Mechanical Engineering Congress and Exposition (1995 Sa/ Chen, Tien Y. Wu ISBN: 0791817369 Publisher: Amer Society of Mechanical Engineers Pub. Date: June, 1995 List Price: $96.00 Amazon.com Price: $96.00 |
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