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1. |  | Title: Electronic Packaging Materials Science VIII by R.C. Sundahl, K.A. Jackson, K.N. Tu, P. Borgesen ISBN: 1558992936 Publisher: Materials Research Society Pub. Date: 01 March, 1999 List Price: $72.00 Amazon.com Price: $72.00 |
| 2. |  | Title: Thin Films, Stresses and Mechanical Properties V by S.P. Baker, C.A. Ross, P.H. Townsend, C.A. Volkert, P. Borgesen ISBN: 155899257X Publisher: Materials Research Society Pub. Date: 01 March, 1999 List Price: $75.00 Amazon.com Price: $75.00 |
| 3. |  | Title: Materials Reliability in Microelectronics IV by P. Borgesen, J.C. Coburn, J.E. Sanchez, K.P. Rodbell, W.F. Filter ISBN: 1558992383 Publisher: Materials Research Society Pub. Date: 01 March, 1999 List Price: $67.00 Amazon.com Price: $67.00 |
| 4. |  | Title: Thin Films: Stresses and Mechanical Properties IV : Symposium Held April 12-16, 1993, San Francisco, California, U.S.A. by P.H. Townsend, T.P. Weihs, J.E. Sanchez, P. Borgesen ISBN: 1558992049 Publisher: Materials Research Society Pub. Date: 01 November, 1993 List Price: $19.50 Amazon.com Price: $19.50 |
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