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Cover ImageTitle: Electronic Packaging Materials Science IX: Symposium Held December 2-5, 1996, Boston, Massachusetts, U.S.A.
by Steven K. Groothuis, Paul, S. Ho, Kenzo Ishida, Tien Wu
ISBN: 1558993495
Publisher: Material Research Society
Pub. Date: February, 2000
List Price: $71.00
Amazon.com Price: $71.00

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