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1. |  | Title: Materials in Microelectronic and Optoelectronic Packaging (Ceramic Transactions, Vol 33) by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla ISBN: 0944904637 Publisher: The American Ceramic Society Pub. Date: July, 1993 List Price: $74.00 Amazon.com Price: $74.00 |
| 2. |  | Title: Ceramic Dielectrics: Composition, Processing and Properties (Ceramic Transactions, Vol 8) by Symposium on Ceramic Dielectrics, Man F. Yan, Hung C. Ling ISBN: 094490422X Publisher: The American Ceramic Society Pub. Date: June, 1990 List Price: $20.00 Amazon.com Price: $20.00 |
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