AnyBook4Less.com - ISBN: 0471594466 - Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines : A Focus on Reliability by Michael G. Pecht

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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines : A Focus on Reliability

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Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines : A Focus on Reliability
by Michael G. Pecht
ISBN: 0-471-59446-6
Publisher: Wiley-Interscience
Pub. Date: 15 February, 1994
Format: Hardcover
Volumes: 1
List Price(USD): $140.00

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