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Title: Microelectronics Packaging Handbook: Subsystem Packaging (Microelectronics Packaginm Handbook, 2nd Ed, Part 3) by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ISBN: 0-412-08451-1 Publisher: Kluwer Academic Publishers Pub. Date: January, 1997 Format: Hardcover Volumes: 1 List Price(USD): $173.50

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Average Customer Rating: 5 (1 review)

Rating: 5
Summary: Better than Godot.
Comment: I was not able to review this book because it is not available. However, it is such a good book that the anticipation of its arrival is better than Waiting for Godot.