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Title: Fundamentals of Microsystems Packaging by Rao Tummala, Rao Tummala ISBN: 0-07-137169-9 Publisher: McGraw-Hill Professional Pub. Date: 08 May, 2001 Format: Hardcover Volumes: 1 List Price(USD): $89.95 |
Average Customer Rating: 3 (2 reviews)
Rating: 1
Summary: This book is garbage
Comment: Nothing personal, for those who give more than 2 stars for this book, you are either a friend of the author, got the book for free, or never really review it throroughly. Here are the reason why:
1. Nothing is new in this book that you can get it off the web
2. Equations were given without fully specify its component
3. You can't work the problem in the back of the chapter because there are no materials in the chapter to support it. You need your old engineering book in order to solve these problems
4. Problems were stated unclear and incorrect. For example, he ask to calculate an N-channel MOSFET transistor problem, but the figure he used is a P-channel. It seems like the author either pull these problems out of this behind or took these problems from other engineering books and change some values to make it different, but unfortunately, those values were unworkable.
5. Pretty thick book for a lot of garbage. If I need to work electrical or heat transfer problems, I'll go to my old engineering book at least those authors know their materials.
Rating: 5
Summary: All About Microsystems Packaging
Comment: "Fundamentals of Microsystems Packaging" is an informative, well-written textbook, the first to cover this rapidly-evolving technology. Professor Tummala's latest book should appeal to only three groups: those who know a lot about microsystems packaging, those who know something about it, and those who know nothing about it.
Microsystems packaging specialists, who typically focus on one sub-specialty, will find this detailed exposition of the entire field broadening. Non-specialists with some general packaging knowledge will find here all that they need to fully understand and work with the key elements of microsystems packaging. Novices, students, and those in related technical fields will find a well-structured introduction that prepares them to deal with microsystems packaging.
This comprehensive textbook offers to all of the above groups a firm grounding in the diverse disciplines comprising microsystems packaging. Nineteen of the chapters share the title, "Fundamentals of ...". "Fundamental" means "a foundation," and that is what these chapters provide, covering the key elements of topics ranging from semiconductors to systems, including design, processing, materials, manufacture, testing, performance, reliability, thermal management, and environmental considerations.
For the specialist, who must build upon these foundations, each chapter includes a judicious selection of recommended further readings. For the autodidact, the scholar, or the flagellant, there are even homework problems to test your knowledge. Four chapters, covering optoelectronics, MEMS, RF packaging, and wafer-level packaging, lead the venturesome to the borders of today's knowledge, where they might glimpse the promised land, or just gape at the dark forests of ignorance.
Although the text is the child of fifty authors, the logical flow and smooth editing make it a unified work that speaks with one clear voice. Despite their diversity, the 2:1 ratio of academic to practitioner authors makes a good balance of technical rigor and practical experience. Talented illustrators provided a wealth of informative two-color pictures, charts, pictures, and diagrams.
In summary, despite my forty years in microelectronics research, engineering, management, and consulting, I learned new things every time I opened this book.
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Title: Electronic Packaging and Interconnection Handbook by Charles A. Harper ISBN: 0071347453 Publisher: McGraw-Hill Professional Pub. Date: 18 February, 2000 List Price(USD): $125.00 |
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Title: Area Array Packaging Handbook: Manufacturing and Assembly by Ken Gilleo ISBN: 0071374930 Publisher: McGraw-Hill Professional Pub. Date: 05 November, 2001 List Price(USD): $125.00 |
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Title: High-Speed Digital Design: A Handbook of Black Magic by Howard Johnson ISBN: 0133957241 Publisher: Prentice Hall PTR Pub. Date: 08 April, 1993 List Price(USD): $95.00 |
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Title: Electronic Packaging: Design, Materials, Process, and Reliability by John H. Lau, C.P. Wong, J. L. Prince, W. Nakayama ISBN: 0070371350 Publisher: McGraw-Hill Professional Pub. Date: 01 February, 1998 List Price(USD): $69.00 |
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Title: Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield by George G. Harman, Imaps ISBN: 0070326193 Publisher: McGraw-Hill Professional Pub. Date: 01 June, 1997 List Price(USD): $65.00 |
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