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Semiconductor Packaging: A Multidisciplinary Approach

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Title: Semiconductor Packaging: A Multidisciplinary Approach
by Robert J. Hanneman, Allan D. Kraus, Michael Pecht
ISBN: 0-471-18123-4
Publisher: John Wiley & Sons
Pub. Date: 18 March, 1997
Format: Paperback
Volumes: 1
List Price(USD): $110.00
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